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Ancamide® 2573

Ancamide® 2573 curing agent is a modified polyamide adduct, intended for use as an ambient curing agent for liquid epoxy resin. The product is a low viscosity curing agent which exhibits fast cure at low temperatures (5˚C) and over poorly prepared substrates.

Technical data sheet
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This product is NOT available in:

  • Asia Pacific
not available in Latin America


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