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Epilink® 701

Epilink® 701 has been developed primarily for use with liquid epoxy resin, it out-performs solid resin emulsion-based systems by offering the capability to formulate without resin emulsifiers, at zero VOC and with a visable end of pot life. The unique nature of Epilink® 701 provides the ability to develop low cost systems based on high filler levels particularly in flooring applications.

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